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In the solid crystal area, the silica gel is used to form a certain size dam, which is used for the fluorescence silica gel to form a luminous surface
the chip and the circuit on the substrate are connected to guide, it is the chip that can lit normally when energized
DieBond, also known as chip solids, is used to bond wafers to the designated area of the scaffold through colloids (typically conductive or insulating)
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